CVE-2023-33118 Vulnerability Details

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CVE-2023-33118 Metadata Quick Info

CVE Published: 02/01/2024 | CVE Updated: 02/08/2024 | CVE Year: 2023
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon
Status : PUBLISHED

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CVE-2023-33118 Description

Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.

Metrics

CVSS Version: 3.1 | Base Score: 7.8 HIGH
Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

l➤ Exploitability Metrics:
    Attack Vector (AV)* LOCAL
    Attack Complexity (AC)* LOW
    Privileges Required (PR)* LOW
    User Interaction (UI)* NONE
    Scope (S)* UNCHANGED

l➤ Impact Metrics:
    Confidentiality Impact (C)* HIGH
    Integrity Impact (I)* HIGH
    Availability Impact (A)* HIGH

Weakness Enumeration (CWE)

CWE-ID: CWE-416
CWE Name: CWE-416 Use After Free
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).