CVE-2023-33077 Vulnerability Details

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CVE-2023-33077 Metadata Quick Info

CVE Published: 06/02/2024 | CVE Updated: 22/08/2024 | CVE Year: 2023
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon
Status : PUBLISHED

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CVE-2023-33077 Description

Memory corruption in HLOS while converting from authorization token to HIDL vector.

Metrics

CVSS Version: 3.1 | Base Score: 6.7 MEDIUM
Vector: CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H

l➤ Exploitability Metrics:
    Attack Vector (AV)* LOCAL
    Attack Complexity (AC)* LOW
    Privileges Required (PR)* HIGH
    User Interaction (UI)* NONE
    Scope (S)* UNCHANGED

l➤ Impact Metrics:
    Confidentiality Impact (C)* HIGH
    Integrity Impact (I)* HIGH
    Availability Impact (A)* HIGH

Weakness Enumeration (CWE)

CWE-ID: CWE-120
CWE Name: CWE-120 Buffer Copy Without Checking Size of Input ( Classic Buffer Overflow )
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).