CVE-2022-33217 Vulnerability Details

  /     /     /  

CVE-2022-33217 Metadata Quick Info

CVE Published: 17/10/2022 | CVE Updated: 03/08/2024 | CVE Year: 2022
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Mobile
Status : PUBLISHED

---

CVE-2022-33217 Description

Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

Metrics

CVSS Version: 3.1 | Base Score: 7.8 HIGH
Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

l➤ Exploitability Metrics:
    Attack Vector (AV)* LOCAL
    Attack Complexity (AC)* LOW
    Privileges Required (PR)* LOW
    User Interaction (UI)* NONE
    Scope (S)* UNCHANGED

l➤ Impact Metrics:
    Confidentiality Impact (C)* HIGH
    Integrity Impact (I)* HIGH
    Availability Impact (A)* HIGH

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Buffer copy without checking size of input in Qualcomm IPC
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).