CVE-2022-25677 Vulnerability Details

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CVE-2022-25677 Metadata Quick Info

CVE Published: 13/12/2022 | CVE Updated: 03/08/2024 | CVE Year: 2022
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Status : PUBLISHED

CVE-2022-25677 Description

Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

Metrics

CVSS Version: 3.1 | Base Score: 6.7 MEDIUM
Vector: CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H

l➤ Exploitability Metrics:
    Attack Vector (AV)* LOCAL
    Attack Complexity (AC)* LOW
    Privileges Required (PR)* HIGH
    User Interaction (UI)* NONE
    Scope (S)* UNCHANGED

l➤ Impact Metrics:
    Confidentiality Impact (C)* HIGH
    Integrity Impact (I)* HIGH
    Availability Impact (A)* HIGH

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Use After Free in DIAG
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).