CVE-2021-30350 Vulnerability Details

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CVE-2021-30350 Metadata Quick Info

CVE Published: 14/06/2022 | CVE Updated: 03/08/2024 | CVE Year: 2021
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Status : PUBLISHED

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CVE-2021-30350 Description

Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

Metrics

CVSS Version: 3.1 | Base Score: 8.4 HIGH
Vector: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

l➤ Exploitability Metrics:
    Attack Vector (AV)* LOCAL
    Attack Complexity (AC)* LOW
    Privileges Required (PR)* NONE
    User Interaction (UI)* NONE
    Scope (S)* UNCHANGED

l➤ Impact Metrics:
    Confidentiality Impact (C)* HIGH
    Integrity Impact (I)* HIGH
    Availability Impact (A)* HIGH

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Improper Authentication in Core
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).