CVE-2021-30308 Vulnerability Details

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CVE-2021-30308 Metadata Quick Info

CVE Published: 13/01/2022 | CVE Updated: 03/08/2024 | CVE Year: 2021
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Status : PUBLISHED

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CVE-2021-30308 Description

Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Metrics

CVSS Version: 3.1 | Base Score: 7.8 HIGH
Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

l➤ Exploitability Metrics:
    Attack Vector (AV)* LOCAL
    Attack Complexity (AC)* LOW
    Privileges Required (PR)* LOW
    User Interaction (UI)* NONE
    Scope (S)* UNCHANGED

l➤ Impact Metrics:
    Confidentiality Impact (C)* HIGH
    Integrity Impact (I)* HIGH
    Availability Impact (A)* HIGH

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Buffer Copy Without Checking Size of Input in Modem
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).