CVE-2020-3629 Vulnerability Details

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CVE-2020-3629 Metadata Quick Info

CVE Published: 08/09/2020 | CVE Updated: 04/08/2024 | CVE Year: 2020
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Status : PUBLISHED

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CVE-2020-3629 Description

u\'Stack out of bound issue occurs when making query to DSP capabilities due to wrong assumption was made on determining the buffer size for the DSP attributes\' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in Bitra, Kamorta, Rennell, SC7180, SDM845, SM6150, SM7150, SM8150, SM8250, SXR2130

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Buffer Copy Without Checking Size of input in DSP Services
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).