CVE-2020-11255 Vulnerability Details

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CVE-2020-11255 Metadata Quick Info

CVE Published: 07/04/2021 | CVE Updated: 04/08/2024 | CVE Year: 2020
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables
Status : PUBLISHED

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CVE-2020-11255 Description

Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables

Metrics

CVSS Version: 3.1 | Base Score: 7.5 HIGH
Vector: CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H

l➤ Exploitability Metrics:
    Attack Vector (AV)* NETWORK
    Attack Complexity (AC)* LOW
    Privileges Required (PR)* NONE
    User Interaction (UI)* NONE
    Scope (S)* UNCHANGED

l➤ Impact Metrics:
    Confidentiality Impact (C)* NONE
    Integrity Impact (I)* NONE
    Availability Impact (A)* HIGH

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Improper Release of Memory Before Removing Last Reference in Data Modem
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).