CVE-2020-11239 Vulnerability Details

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CVE-2020-11239 Metadata Quick Info

CVE Published: 09/06/2021 | CVE Updated: 04/08/2024 | CVE Year: 2020
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Status : PUBLISHED

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CVE-2020-11239 Description

Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Use After Free in Graphics
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).