CVE-2019-10612 Vulnerability Details

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CVE-2019-10612 Metadata Quick Info

CVE Published: 05/03/2020 | CVE Updated: 04/08/2024 | CVE Year: 2019
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Status : PUBLISHED

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CVE-2019-10612 Description

UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Untrusted Pointer Dereference Issue in Kernel
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).