CVE-2019-10604 Vulnerability Details

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CVE-2019-10604 Metadata Quick Info

CVE Published: 05/03/2020 | CVE Updated: 04/08/2024 | CVE Year: 2019
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Status : PUBLISHED

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CVE-2019-10604 Description

Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag command response packet, in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Buffer Copy Without Checking Size of Input in Debug Tools
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).