CVE-2019-10517 Vulnerability Details

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CVE-2019-10517 Metadata Quick Info

CVE Published: 18/12/2019 | CVE Updated: 04/08/2024 | CVE Year: 2019
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Status : PUBLISHED

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CVE-2019-10517 Description

Memory is being freed up twice when two concurrent threads are executing in parallel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8996AU, QCS405, QCS605, SDA660, SDA845, SDM630, SDM636, SDM660, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Double Free Issues in DSP Services
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).