CVE Published: 06/07/2018 |
CVE Updated: 16/09/2024 |
CVE Year: 2018 Source: qualcomm |
Vendor: Qualcomm, Inc. |
Product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Status : PUBLISHED
CVE-2018-5878 Description
While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.