CVE-2017-18329 Vulnerability Details

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CVE-2017-18329 Metadata Quick Info

CVE Published: 03/01/2019 | CVE Updated: 05/08/2024 | CVE Year: 2017
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Mobile, Snapdragon Wear
Status : PUBLISHED

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CVE-2017-18329 Description

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Buffer Copy Without Checking Size of Input in Modem Data
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).