CVE-2017-18295 Vulnerability Details

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CVE-2017-18295 Metadata Quick Info

CVE Published: 23/10/2018 | CVE Updated: 05/08/2024 | CVE Year: 2017
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Status : PUBLISHED

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CVE-2017-18295 Description

Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20.

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Buffer Copy Without Checking Size of Input in DSP Services
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).