CVE-2017-18173 Vulnerability Details

  /     /     /  

CVE-2017-18173 Metadata Quick Info

CVE Published: 06/05/2019 | CVE Updated: 05/08/2024 | CVE Year: 2017
Source: qualcomm | Vendor: Qualcomm Technologies, Inc. | Product: Snapdragon Mobile
Status : PUBLISHED

---

CVE-2017-18173 Description

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: CWE190: Integer Overflow or Wraparound
Source: Qualcomm Technologies, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).