CVE-2017-18172 Vulnerability Details

  /     /     /  

CVE-2017-18172 Metadata Quick Info

CVE Published: 23/10/2018 | CVE Updated: 05/08/2024 | CVE Year: 2017
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Automobile, Snapdragon Mobile
Status : PUBLISHED

---

CVE-2017-18172 Description

In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Integer Overflow or Wraparound in SUI
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).