CVE-2017-18140 Vulnerability Details

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CVE-2017-18140 Metadata Quick Info

CVE Published: 11/04/2018 | CVE Updated: 16/09/2024 | CVE Year: 2017
Source: qualcomm | Vendor: Qualcomm, Inc. | Product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Status : PUBLISHED

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CVE-2017-18140 Description

In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.

Metrics

CVSS Version: 3.1 | Base Score: n/a
Vector: n/a

l➤ Exploitability Metrics:
    Attack Vector (AV)*
    Attack Complexity (AC)*
    Privileges Required (PR)*
    User Interaction (UI)*
    Scope (S)*

l➤ Impact Metrics:
    Confidentiality Impact (C)*
    Integrity Impact (I)*
    Availability Impact (A)*

Weakness Enumeration (CWE)

CWE-ID:
CWE Name: Use After Free in Data
Source: Qualcomm, Inc.

Common Attack Pattern Enumeration and Classification (CAPEC)

CAPEC-ID:
CAPEC Description:


Source: NVD (National Vulnerability Database).